Package Selection and Design, Assembly, and Test

• Selecting the IC package and material set is a critical step effecting the assembly and long term product reliability.
• Packaging for lower power, I/O count, and performance can be achieved with lead frames and plastic encapsulation.
• I/O counts above ~160 pin & toggle rates above ~200Mhz will push toward one of the ball grid array material sets.
• The power required to drive higher baseline IC performance levels will drive package and board thermal design.